KOR KOR

KOR ENG

Twin Vacuum Reflow

Perfect solution to critical Tact Time of Vacuum Equipment

VACCUM REFLOW

TRV - SERIES

  • Two Vacuum chamber + Two ovens, independent operation
  • Reduction of production line space with compact design
  • Independent system for each lane (temperature setting per lane, production available with one lane when one lane is PM)

  • 01. Effect of vacuum function

    Combination of heating up heat wind circulation and vacuum reduces occurring Void despite of large space soldering.

  • 02. Effect of reduction of Void

    Secure forming fine fillet with thin and event solder thanks to reduction of Void and effect of self alignment from swelling and twisting.

  • 03. PCB transferring system optimized for in-line production

  • 04. Heating performance

    Secure high quality Soldering with even lower number of zone through combination of vacuum chamber and up / down heating circulation, improved for previous temperature profile condition.

  • 05. Ultra low power consumption

    Realize ultra low power consumption through “RO” lightening main body and high insulation and saving of energy, CO2 and electricity cost.

  • 06. High insulation specification

    Combination of the low thermal conductivity, doubling insulation materials, resinification of insulation cover and ultra low power consumption of electricity enables dramatic reduction of energy and CO

  • 07. Collecting System of Flux (TSM)

    TSM : Single Ass'y structure combined for each UNIT enables one touch separation, exchange and re operation; able to extend Flux PM period by applying 2FMS on recent equipment. ETC : Highly perform on collecting Flux thanks to deploying dust collection UNIT, respectively per preheating, heating and cooling process and easy access on cleaning with cleaning liquid due to separating filter each box.

  • 08. Vacuum Chamber

    Effective degree of vacuum with complete close vacuum chamber enables to control and reduce Void effectively

  • 09. Filter Unit

    Protect Flux contamination of Vacuum Pump through multi-staged filters and realize simple cleanin.

  • 10. Controlling degree of a vacuum with three stage

    Flexibly handling control of degree of a vacuum with multi stage control according to characteristics of product.

  • 11. MMI realization function of degree of a vacuum graph (Option)

    Able to monitor degree of a vacuum with its graph on MMI monitor.

  • 12. RPMS: indicating a number of spinning MMI function for all zone B/M rpm (Option)

    Visualize a number of spinning blower motor fans in real time. Alert with alarm if out of setting order caused by an error of its motor.

사양 / Specifications

Name of Models TRVⅠ- f612-WD TRVⅠ- f612-LE TRVⅢ- a612WT TRVⅢ- a612LT
Heating (zone) 6 6
Vacuum (zone) 1
Cooling (zone) 2
Voltage 3Ø 380V
Heating temperature Max 350 °C
Degree of vacuum 1~10 kPa
Consumption capacity of nitrogen 300~400ℓ/min
Outer length 5,406mm 6,286mm 5,406mm 6,286mm
Name of Models TRVⅠ- f612-WD TRVⅠ- f612-LE TRVⅢ- a612WT TRVⅢ- a612LT
Outer width 6 2,525mm 2,365mm
Outer height 1,550mm
Height of passing parts Upper 30mm / Lower 30mm
Width of control panel 100~250mm 100~330mm 100~250mm 100~330mm
Length of control panel 100~250mm 100~330mm 100~250mm 100~330mm
Height of remand 900~920mm (STD 900mm)
Collection of Flux 표준 장착 (2 FMS)
Option Roller 부착 레일 / 대형 사이즈 챔버 / 3Ø 380V 외 전압

Model Numbering

SPEC
Twin Vacuum Reflow

TRV III-a Series

Don’t worry Tact Time of Vacuum Reflow anymore!
Secure overall Productivity Balance with TSM’s
Twin Vacuum Reflow in Line by realizing level
of Tact Time equivalent to other Reflows

Product features

  • · Independent Twin Vacuum Reflow as the World Premier (2X Vacuum Chamber + 2X Oven + 2X PC independent operation)
  • · Doubled productivity compared to Single Reflow
  • · World’s best tract time (min. 15 sec /PCB)
  • · Optimized to mass production line
  • · Basic application of TRV I-f model’s specifications
  • · Completely vacuumable dedicated compression chamber of TSM’s vacuum Reflow
  • · Transport System without jamming PCB (ETC Technical Partnership)
  • · Minimize the gab of in/out conveyor to prevent PCB Drop
  • · Enhanced durability with none conveyor driven roller in high temperature sections
  • · Able to correspond with embedded small sized vacuum pump, minimized for vacuum chamber
  • · Easy control of vacuum level and reduction of vacuum time
  • · Vacuum Profile Monitoring System
  • · Apply 2 FMS to maximize Flux Collection

Main functions

FMS, Heat Discharging System

Ventilation cost saving during process
by discharging the Heat outside
through the way of sealed duct

Large capacity FMS

Significantly improved cooling and
Flux dust performance
with twice larger capacity

Circulation Temperature Monitoring of FMS

Checking operation condition of
FMS in real time if abnormal,
alarm functions.

Output Monitoring of Heater Control

Detecting a problem in advance
by checking normal operation of heater and
displaying heater output on MMI

Monitoring a number of rotations of B/M

Real time monitoring spinning numbers of B/M
and checking normal operation status
of motor spinning in each zone
and alarm function applied

Sensing the level of Flux capacity of FMS Function

A function that notifies the Flux PM cycle
with an alarm after detecting the Flux level in
the FMS’s Drain Bottle.

Water cooling FMS

Maximizing cooling rate and efficiency
of Flux dust collection by applying
water cooling 3X8 Radiator

Convenient Monitor Configuration

Improve user convenience with intuitive
easy-to-see configuration
of required information

RTPM

With temperature measurement inside of oven
in real time, provision of temperature
related information when changing
models does not require checking
profile.

RPPM

Monitoring conditions of O2 ppm
in all zone at all time, managing
O2 ppm Profile Graph Data
according to types of production

Controlling degree of a vacuum with three stage

Flexibly handling control of degree
of a vacuum with multi stage control according
to characteristics of product

Effect of vacuum function

Combination of heating up heat wind circulation
and vacuum reduces occurring Void despite
of large space soldering

Optimized PCB transferring system

Realize stable design with PCB
transfer specialized for vacuum Reflow

Vacuum Chamber

Effective degree of vacuum with complete
close vacuum chamber enables to control
and reduce Void effectively.

Realization of degree of a vacuum graph

Realization of degree of a vacuum graph
Able to monitor degree of a vacuum with
its graph on MMI monitor.