Vacuum Reflow(Single)
The world’s exclusive Productivity (Shortest Tact Time)
Vacuum Reflow with significant reduction of Void!
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- Dramatically reduction of Solder Void
- Void area with solder combination allows less than 1%
- Improved electrical features and reliability of its connectivity
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- Eco-friendly ultra low power consumption and high thermal insulation specification
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- Standard option for high efficiency and collection system of large quantity Flux
- Minimizing Flux PM period
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- PCB transferring system optimized for In-Line production
- Support continuous production with at least 30 seconds of tack time
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- heating method of up/down hot air circulation
- Vacuum Reflow Soldering on both side mounting boards and vacuum Flow with one-time allow reduction of Void
- The combination of upper & lower hot air circulation heating and vacuum pressure secures high quality and reliable Soldering
- Allow Soldering on the metal substrates with aluminum heat sink
- Low temperature deviation (Δt) compared to Hot Plate heating method and high heat transfer rate can be shorten Reflow time
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- Able to utilize as a general N2•Air Reflow Oven
Feature
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01. Effect of vacuum function
Combination of heating up heat wind circulation and vacuum reduces occurring Void despite of large space soldering.
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02. Effect of reduction of Void
Secure forming fine fillet with thin and event solder thanks to reduction of Void and effect of self alignment from swelling and twisting.
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03. PCB transferring system optimized for in-line production
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04. Heating performance
Secure high quality Soldering with even lower number of zone through combination of vacuum chamber and up / down heating circulation, improved for previous temperature profile condition.
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05. Ultra low power consumption
Realize ultra low power consumption through “RO” lightening main body and high insulation and saving of energy, CO2 and electricity cost
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06. Filter Unit
Protect Flux contamination of Vacuum Pump through multi-staged filters and realize simple cleanin.
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07. High insulation specification
Combination of the low thermal conductivity, doubling insulation materials, resinification of insulation cover and ultra low power consumption of electricity enables dramatic reduction of energy and CO2
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08. Collecting System of Flux (TSM)
Single Ass'y structure combined for each UNIT enables one touch separation, exchange and re operation; able to extend Flux PM period by applying 2FMS on recent equipment.
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09. Collecting System of Flux (ETC)
Highly perform on collecting Flux thanks to deploying dust collection UNIT, respectively per preheating, heating and cooling process and easy access on cleaning with cleaning liquid due to separating filter each box.
Model Numbering
SPECTRV III-f Series
The TRV series provides the highest productivity and stability of equipment operation, In particular, compact vacuum jambers and conveyors are manufactured through technical cooperation with ETC. This is a field-proven solution.
Product features
- · Compression chamber exclusively for TSM's exclusive vacuum reflow that can be completely sealed
- · Transfer system without PCB jamming (ETC technology partnership)
- · PCB drop prevention by minimizing the conveyor gap at the entrance and exit of the vacuum chamber
- · Enhanced durability by not applying a conveyor driving roller in the high-temperature section
- · The vacuum chamber is minimized so that even a small-capacity built-in vacuum pump can be used
- · Easy to control the degree of vacuum and shorten the vacuum time
- · Vacuum Profile Monitoring System
- · Apply 2 FMS to maximize Flux Collection